By Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)
Back disguise replica sequence: built-in Circuits and structures 3D-Integration for NoC-based SoC Architectures through: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This booklet investigates at the gives you, demanding situations, and strategies for the 3D Integration (vertically stacking) of embedded structures attached through a community on a chip. It covers the total architectural layout procedure for 3D-SoCs. 3D-Integration applied sciences, 3D-Design ideas, and 3D-Architectures have emerged as issues serious for present R&D resulting in a huge variety of goods. This e-book offers a accomplished, system-level review of third-dimensional architectures and micro-architectures. •Presents a complete, system-level assessment of third-dimensional architectures and micro-architectures; •Covers the full architectural layout strategy for 3D-SoCs; •Includes state of the art therapy of 3D-Integration applied sciences, 3D-Design suggestions, and 3D-Architectures.
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Extra resources for 3D Integration for NoC-based SoC Architectures
If the memory is completely distributed, we assume all memory reads and writes are local and no long-range communication is required. Obviously, this is a simplification but any specific architecture-application pair can be characterized by a Δ value between 0 and 1, denoting the amount of global on-chip communication occurring. • We explore different 2-D and 3-D topologies but we typically compare systems with the same total silicon area. For example if the total area is 400Â€mm2, the configurations considered are − − − − − 2D: one plain silicon die of size 20â•›×â•›20Â€mm2; 3D2: two dies stacked upon each other, each 200Â€mm2; 3D4: four dies stacked upon each other, each 100Â€mm2; 3D8: eight dies stacked upon each other, each 50Â€mm2; 3D16: sixteen dies stacked upon each other, each 25Â€mm2.
Y. Weldezion, M. Grange, D. Pamunuwa, Z. Lu, A. Jantsch, R. Weerasekera and H. Tenhunen. Scalability of network-on-chip communication architecture for 3-D meshes. Proceedings of the International Symposium on Networks-on-Chip, 2009. â•‡ 5. F. G. Friedman. 3-D topologies for networks-on-chip. IEEE Transactions on Very Large Scale Integration Systems, 15(10):1081, 2007. â•‡ 6. R. Weerasekera, D. -R. Zheng and H. Tenhunen. Two-dimensional and threedimensional integration of heterogeneous electronic systems under cost, performance and technological constraints.
Tensile test results show that high bonding strength equivalent to bulk material is achieved at room temperature. In , adhesion of Cu–Cu bonded at room temperature in UHV condition was measured to be about ~3Â€J/m2 using AFM tip pull-off method; 2. Cu Nanorod —Recent investigation on surface melting characteristics of copper nanorod arrays shows that the threshold of the morphological changes of the nanorod arrays occurs at a temperature significantly below the copper bulk melting point.